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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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Heat transfer in modern automotive lights
Holec, Radek ; Klimeš, Lubomír (referee) ; Štětina, Josef (advisor)
The beginning of this thesis is dedicated to light in general and all different types of vehicle lightning, also deals with various types of light sources and specifically about LED where it describes the temperature change behaviour. Second part deals with heat transfer by conduction, convection, and radiation, it describes quantities and relationships needed for next capitols. In the penultimate part is described thermal management of headlights, therefore different options of cooling and causes of heat generation, and different types of PCBs that are used in automotive. In the last part is proposed the heatsink, which should be used for cooling LED chips of daytime running lights.
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Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Thermal Properties of Automotive Light Sources
Halbich, Adam ; Štěpánek, Jaroslav (referee) ; Baxant, Petr (advisor)
The goal of this thesis was to process theoretical basis required for better understanding the matters of thermal simulations, to perform particular simulation and its debugging according to the measurement on actual sample. Theoretical part focuses on the variety of the automotive light sources, then kinds of heat transfer, thermal simulations and possibilities of measurement and results verifying. Practical approach was consisted of reverse engineering of particular light source and building its 3D model. In consequence, the characterization of the material properties was made. At the end the thermal simulation of designed 3D model was performed and the optimalization according to realized measurement was implemented.
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Study of BGA and QFN package properties
Skácel, Josef ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
This work deals with the issue of packaging and heat transfer. Especially this work focused on QFN and BGA packages. Nowadays most sophisticated conventional solution. First part deals with analysis of the current status of packages. Next part is analyze the issue of heat transfer in electronic systems. The following section is an experimental dealing with simulation in ANSYS Workbench and validation of these simulations by designed test structures. At the end is evaluated properties and behavior of these packages.
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Exposure equipment for PCBs
Fiala, Matouš ; Čech, Ondřej (referee) ; Vyroubal, Petr (advisor)
The Master's thesis deals with the fabrication of printed circuit board exposure devices, including establishing a theoretical basis for understanding the PCB production process, using lithography over a liquid crystal panel to create a motif. The thesis includes the creation of a CAD model of the device, including a UV source and then thermal simulation of the cooling of the device. The fabrication of the device also involved the creation of a custom motherboard that integrates all of the electronic components. The main result of this work is an assembled functional device with a unique LCD layer arrangement that allows reliable exposure of dual-layer PCBs, which is supported by testing. The most comprehensive part of this thesis deals with the development of a complete software platform, consisting of an application running on the microcomputer of the exposure device and a multi-platform application through which the device is wirelessly controlled.
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Heat transfer in modern automotive lights
Holec, Radek ; Klimeš, Lubomír (referee) ; Štětina, Josef (advisor)
The beginning of this thesis is dedicated to light in general and all different types of vehicle lightning, also deals with various types of light sources and specifically about LED where it describes the temperature change behaviour. Second part deals with heat transfer by conduction, convection, and radiation, it describes quantities and relationships needed for next capitols. In the penultimate part is described thermal management of headlights, therefore different options of cooling and causes of heat generation, and different types of PCBs that are used in automotive. In the last part is proposed the heatsink, which should be used for cooling LED chips of daytime running lights.
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Thermal Properties of Automotive Light Sources
Halbich, Adam ; Štěpánek, Jaroslav (referee) ; Baxant, Petr (advisor)
The goal of this thesis was to process theoretical basis required for better understanding the matters of thermal simulations, to perform particular simulation and its debugging according to the measurement on actual sample. Theoretical part focuses on the variety of the automotive light sources, then kinds of heat transfer, thermal simulations and possibilities of measurement and results verifying. Practical approach was consisted of reverse engineering of particular light source and building its 3D model. In consequence, the characterization of the material properties was made. At the end the thermal simulation of designed 3D model was performed and the optimalization according to realized measurement was implemented.
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